Ebook Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling, by Gordon Ellison
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Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling, by Gordon Ellison
Ebook Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling, by Gordon Ellison
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A total revision of the author’s previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors.
The beginning of this book is largely devoted to prediction of airflow and well-mixed air temperatures in systems and heat sinks, after which it explores convective heat transfer from heat sinks, circuit boards, and components. Applying a systematic presentation of information to enhance understanding and computational practice, this book:
- Provides complete mathematical derivations and supplements formulae with design plots
- Offers complete exercise solutions (Mathcad™ worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book
- Addresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction
- Presents mathematical descriptions of large thermal network problem formulation
- Discusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problems
This reference is useful as a professional resource and also ideal for use in a complete course on the subject of electronics cooling, with its suggested course schedule and other helpful advice for instructors. Selected sections may be used as application examples in a traditional heat transfer course or to help professionals improve practical computational applications.
- Sales Rank: #2845645 in Books
- Published on: 2010-11-08
- Original language: English
- Number of items: 1
- Dimensions: 10.00" h x 1.00" w x 7.20" l, .0 pounds
- Binding: Hardcover
- 416 pages
Review
The material is presented in a practical way, very suitable for engineers and scientists, helping users at all levels to strengthen their grasp of the subject. ... One of its best aspects is the large number of worked examples ... The many problems at the end of each chapter will also make the book attractive for an undergraduate engineering course. ... Those who want to be able to perform their own calculations and make estimates without using a commercially available software package will find this book invaluable. It will help them to understand the relevant thermal mechanisms and save considerable time by solving frequently encountered thermal design problems in real equipment in an efficient manner. ... This is a book well worth owning.
―John J. Shea, in IEEE Electrical Insulation Magazine, Jan/Feb 2012, Vol. 28, No. 1
About the Author
Gordon N. Ellison has a BA in Physics from the University of California at Los Angeles (UCLA) and an MA in Physics from the University of Southern California (USC). His career in thermal engineering includes eight years as a Technical Specialist at NCR and 18 years at Tektronix, Inc., retiring from the latter as a Tektronix Fellow. Over the last 15 years Mr. Ellison has been an independent consultant and has also taught the course, Thermal Analysis for Electronics, at Portland State University, Oregon. He has also designed and written several thermal analysis computer codes.
Most helpful customer reviews
6 of 8 people found the following review helpful.
Huh?
By Thomas T.
The description claims ...
"Offers complete exercise solutions (Mathcad(tm) worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book."
Truth is that there are indeed MathCAD files, but the book doesn't come with a CD nor any description on how to get the files. Go to CRCpress' website to find the book and download the "Updates". Still no PDF files as claimed, and no reference anywhere how to get them.
Still evaluating the book, and so far it seems useful albeit a bit crammed and not a simple topic. I bought it mostly for the MathCAD worksheets to save time entering formulas etc..
0 of 2 people found the following review helpful.
Never ordered this
By racingisfun
Never ordered this
0 of 0 people found the following review helpful.
But this is still a very nice book to systematically equip your thermal knowledge on electric ...
By L.Y
This book is for who wants to start the design with reliable calculation and analysis. The author explained very well both in formula deduction, citation, application and in the design steps development. If you are a serious engineer on thermal design but don't know how to get started. This is the book. Before you read this book, you need some very fundamental principles of thermodynamics in your mind. This could make your life much easier when you decide to go into this book.
PS: If you want updated errata, you can download from CRC Press Website or connect with author. And also you need to read the book really carefully, because there are some typos. But this is still a very nice book to systematically equip your thermal knowledge on electric packaging side.
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